قائمة مسابك إنتل

Intel is an American multinational corporation and technology company headquartered in Santa Clara, California. Processors are manufactured in semiconductor fabrication plants called "fabs" which are then sent to assembly and testing sites before delivery to customers. Intel has stated that approximately 75% of their semiconductor fabrication is performed in the United States.[1]

Since May 1990, Intel has made an effort to eliminate chlorofluorocarbon consumption for the Oregon, Puerto Rico and Ireland system factories.[2]

Both Schumacher, a division of Air Products & Chemicals, and Intel developed chemical that reduce ozone emission using TRANS-LC or trans 1, 2-dichloroethylene to replace from TCA or 1,1,1-Trichloroethane to grow defect free silicon oxide surfaces.[3]

The Oregon Governor's Award for Toxics Use Reduction recognising Intel's Hillsboro facility achievement in reducing the use of toxic substance and generation of hazardous wastes.[4]

مواقع المسابك الحالية

Intel Ocotillo campus in Chandler, Arizona, U.S.
Intel Ronler Acres in Hillsboro, Oregon, United States
Intel F28 in Kiryat Gat, Israel
اسم المسبك الموقع سنة بدء الانتاج العملية (wafer, node)
AFO الولايات المتحدة Aloha, Oregon, U.S. 1976 300mm, Development
D1B الولايات المتحدة Hillsboro, Oregon, U.S. 1996 300mm, Development
RB1 الولايات المتحدة Hillsboro, Oregon, U.S. 2001 300mm, Development
D1C الولايات المتحدة Hillsboro, Oregon, U.S. 2001 300mm, Development
RP1 الولايات المتحدة Hillsboro, Oregon, U.S. 2001 300mm, Research
D1D الولايات المتحدة Hillsboro, Oregon, U.S. 2003 300mm, Development
D1X الولايات المتحدة Hillsboro, Oregon, U.S. 2013 300mm, Development
Fab 11X الولايات المتحدة Rio Rancho, New Mexico, U.S. 1995 upgrade 2020/2021 with 22/14 300mm, 45 nm/32 nm, Packaging
Fab 12 الولايات المتحدة Chandler, Arizona, U.S. 2006 300mm, 22 nm/14 nm/10 nm
Fab 22 الولايات المتحدة Chandler, Arizona, U.S. 2002 300mm, 22 nm/14 nm/10 nm
Fab 24 جمهورية أيرلندا Leixlip, Ireland 2006 300mm, 14 nm[5]
Fab 28a إسرائيل Kiryat Gat, Israel 1996 300mm, 22 nm
Fab 28 إسرائيل Kiryat Gat, Israel (2023) 300mm, 22nm/14nm/10nm[6][7]
Fab 38 إسرائيل Kiryat Gat, Israel (2024) 300mm, 22 nm[8]
Fab 32 الولايات المتحدة Chandler, Arizona, U.S. 2007 300mm, 22 nm/14 nm/10 nm
Fab 34 جمهورية أيرلندا Leixlip, Ireland 2023 300mm, Intel 4 (previously node 7nm)[9][10]
Fab 42 الولايات المتحدة Chandler, Arizona, U.S. 2020 300mm, 10 nm/5 nm (2024)
Fab 52 الولايات المتحدة Chandler, Arizona, U.S. (2024)[11] 300mm, 18A
Fab 62 الولايات المتحدة Chandler, Arizona, U.S. (2024)[11] 300mm
Fab 27[12] الولايات المتحدة Licking County, Ohio, U.S. (2030–2032) 300mm, 14A
SC2 الولايات المتحدة Santa Clara, California, U.S. Reticle/Masks, Intel Mask Operations[13]
Pelican ماليزيا Penang, Malaysia (2024) 300mm, Packaging[14]
Fab 29 ألمانيا Magdeburg, Saxony-Anhalt, Germany (2027) [15]
پولندا Poland (2025–2027) 300mm, Packaging[15]

مواقع المسابك السابقة

Fab name Fab location Opened Closed Notes
Fab 1 الولايات المتحدة Mountain View, California, U.S. 1968 1981 Formerly located at 365 East Middlefield Road.[16]
Fab 2 الولايات المتحدة Santa Clara, California, U.S. 1968 2009 Located in building SC1, at the corner of Bowers Ave. and Central Expressway[17]
Fab 1A الولايات المتحدة Santa Clara, California, U.S. 1980 1991 Located on Mission College Boulevard
Fab 3 الولايات المتحدة Livermore, California, U.S. 1973[18] 1991 Plant began making wafers in April 1973. First plant outside of the Santa Clara area, and is where the famous Bunny Suits were first introduced.[19] Located on North Mines Road.
Fab 4 الولايات المتحدة Aloha, Oregon, U.S. 1976 1996 (decommissioned)
2016 (demolished) 		First wafer manufacturing plant outside of Silicon Valley and first facility in what is now known as Oregon's Silicon Forest. Production began for 3-inch wafers.[20]
Fab 5 / D1 الولايات المتحدة Aloha, Oregon, U.S. Previously a development facility, then production facility. Currently inactive.[21]
Fab 6 الولايات المتحدة Chandler, Arizona, U.S. 1980 2000 First silicon wafer manufacturing facility in Arizona. Key architecture was the 286 microprocessor.
Fab 7 الولايات المتحدة Rio Rancho, New Mexico, U.S. 1980 2002
2005 (converted to test facility) 		Production focused on flash memory chips. By the time production stopped, plant was producing 0.35 micron-6 inch wafers. In 2005, $105 million was invested to temporarily turn Fab 7 into a testing facility.[22]
Fab 8 إسرائيل Jerusalem, Israel 1985 2008
2009 (converted to die prep facility) 		First Fab outside of the United States. Ended production with, what was at the time, the last 6-inch wafer fab. Building was converted into die prep facility to support nearby Fab 28.[23]
Fab 9 الولايات المتحدة Rio Rancho, New Mexico, U.S. 1987 Facility eventually expanded to merge with Fab 11 in 1999.[24]
D2 الولايات المتحدة Santa Clara, California, U.S. 1989[25] 2009 (decommissioned) Development for these EPROM, Flash memory and microcontroller technology.[26] They expanded this location which was previously used for research and development. They were manufactured by using the eight-inch wafers. They have expanded up to 300,000 square foot complex and adding the 12,000 square feet of "Class-1" clean room bringing up to total of 37,000 square feet.[27] After being decommissioned, was converted into a data center.[28]
Fab 10 / IFO[29][30] جمهورية أيرلندا Leixlip, Ireland 1993 Pentium
Fab 11 الولايات المتحدة Rio Rancho, New Mexico, U.S. (Merged into F11X)
Fab 14 جمهورية أيرلندا Leixlip, Ireland
Fab 15 / D1A الولايات المتحدة Aloha, Oregon, U.S. 2003 (converted to assembly / test) Previously a development Fab named D1A before construction began on D1B in 1994.[31]
Fab 16 الولايات المتحدة Ft. Worth, Texas, U.S. (never opened) 2003 (canceled) Planned to open in Ft. Worth, Texas, in 1999, but was eventually canceled in 2003.[32]
Fab 17 الولايات المتحدة Hudson, Massachusetts, U.S. 1998 (acquired from DEC) 2014 Facility used older technology and closed (along with Fab 11X) because site was not large enough to accommodate a leading-edge fab. Made specialty products on the trailing edge of chip technology, and was last to make chips on 200-millimeter silicon wafers.[33]
Fab 20 / D1B الولايات المتحدة, Hillsboro, Oregon, U.S.
Fab 23 الولايات المتحدة Colorado Springs, Colorado, U.S. 2000 (acquired from Rockwell) 2007 Site originally purchased from Rockwell, but due to lack of demand and for financial reasons, Intel put it up for sale in 2007. It eventually sold in 2011 to the El Paso County government, who repurposed the offices.[34]
Fab 68 الصين Dalian, Liaoning, China 2010/2016 2021 3DNAND, 3DXPoint[35][36] fab that was sold to SK Hynix[37]

Assembly and test sites

  • AFO, Aloha, Oregon, United States
  • Chandler, Arizona, United States
  • CD1, Chengdu, Sichuan, China
  • CD6, Chengdu, Sichuan, China
  • KMDSDP, Kulim, Malaysia
  • KMO, Kulim, Malaysia
  • KM5, Kulim, Malaysia
  • PG8, Penang, Malaysia
  • VNAT, Ho Chi Minh City, Vietnam
  • Jerusalem, Israel
  • CRAT, Heredia, Belén, Costa Rica (1997–2014; 2020 – present)[38][39]
  • Makati, Philippines – MN1-MN5 also known as A2/T11 (1974–2009)
  • Cavite, Philippines – CV1-CV4 (1997–2009)
  • Shanghai, China (former Assembly / Test Manufacturing)
  • Las Piedras Puerto Rico 1991-2001 (assemble Pentium CPU/Motherboards)
  • Wroclaw/Walbrzych, Poland - planned 2027 (former Assembly / Test Manufacturing)

انظر أيضاً

وصلات خارجية

Global Manufacturing at Intel

المراجع

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